MicReD® (Microelectronics Research and Development) family of hardware and software products enables component and systems suppliers to accurately and efficiently thermally test, measure and characterize integrated circuit packages, single and arrayed LEDs, stacked and multi-die packages, power electronics, thermal interface materials (TIMs), and complete electronic systems. MicReD was a spin-off company created by researchers at the Department of Electron Devices at the Budapest University of Technology & Economics (BME).
MicReD products are used in the semiconductor, consumer electronics, transportation and LED industries.
Transient thermal test, measurement and characterization of Ics, LEDs and assorted packages.
Thermal and Radiometric/Photometric measurement of LEDs and LED arrays.
Thermal characterization of thermal interface materials.
Thermal test and power cycling of IGBTs
Thermal test and power cycling for automotive IGBTs and MOSFETs.
- Fast and accurate transient thermal test, measurement and characterization of IC packages, LEDs, LED arrays and systems.
- Full support of the transient dual interface method (JEDEC JESD51-14) and the latest LED thermal testing standards (e.g. JEDEC JESD51-51, 51-52).
- Create compact thermal models for accurate thermal simulation in FloTHERM.
- Non-destructive failure detection of IC packages and LEDs – used e.g. as a post-stress test method in reliability analysis.